Technical Program

432: Metamaterial Structures for Antenna Enhancement

Session Type: Oral
Time: Thursday, July 10, 13:20 - 15:20
Location: L11
Session Chair: Dimitrios Sounas, University of Texas at Austin
 
432.1: ANALYSIS OF LOW-PROFILE ANTENNAS ON ISOIMPEDANCE METAMATERIAL SUBSTRATES USING A NOVEL ROBUST SPECTRAL-DOMAIN INTEGRATION METHODOLOGY
         Kamalesh Sainath; The Ohio State University ElectroScience Laboratory, United States
         Fernando L. Teixeira; The Ohio State University ElectroScience Laboratory, United States
 
432.2: ENHANCEMENT OF THE DIPOLE ANTENNA USING A CAPCITIVELY LOADED LOOP (CLL) STRUCTURE
         John Hodge; Virginia Polytechnic Institute and State University, United States
         Theodore Anthony; U.S. Army Research Laboratory, United States
         Amir Zaghloul; Virginia Polytechnic Institute and State University; U.S. Army Research Lab, United States
 
432.3: HIGH-DIRECTIVITY ANTENNA USING RECONFIGURABLE NEAR-ZERO INDEX METAMATERIAL SUPERSTRATES
         Haixia Liu; Xidian University, China
         Yingchun Fan; Xidian University, China
         Kai Zhou; Xidian University, China
         Long Li; Xidian University, China
         Xiaowei Shi; Xidian University, China
 
432.4: TAILORING LEAKY-WAVE RADIATION WITH IMPEDANCE SURFACES
         Brian Tierney; University of Michigan, United States
         Anthony Grbic; University of Michigan, United States
 
432.5: LEFT-HANDED LOOP ANTENNA
         Hisamatsu Nakano; Hosei University, Japan
         Kenta Yoshida; Hosei University, Japan
         Junji Yamauchi; Hosei University, Japan
 
432.6: CONFORMAL ANTENNAS BASED ON HOLOGRAPHIC ARTIFICIAL IMPEDANCE SURFACES
         Yuan Zhang; University of Electronic Science and Technology of China, China
         Jun Ouyang; University of Electronic Science and Technology of China, China
         Kaizhi Zhang; University of Electronic Science and Technology of China, China
         Yu Long; University of Electronic Science and Technology of China, China
         Longjian Zhou; University of Electronic Science and Technology of China, China
         Feng Yang; University of Electronic Science and Technology of China, China